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 HD74HC257
Quad. 2-to-1-line Data Selectors/Multiplexers (with noninverted 3-state outputs)
REJ03D0601-0200 (Previous ADE-205-478) Rev.2.00 Jan 31, 2006
Description
The large output drive capability coupled with the 3-state feature make this device ideal for interfacing with bus lines in a bus organized system. When the output control input line is taken high, the outputs of all four multiplexers are sent into a high impedance state. When the output control line is low, the select input chooses whether the A or B input is used.
Features
* * * * * * High Speed Operation: tpd (Data to Y) = 10.5 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) Ordering Information
Part Name HD74HC257P HD74HC257FPEL HD74HC257RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Abbreviation P FP -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) Taping Abbreviation (Quantity)
PRSP0016DG-A RP (FP-16DNV) Note: Please consult the sales office for the above package availability.
Function Table
Inputs Output Control Select L L L L L H L H H X Notes H: high level, L: low level, X: irrelevant A L H X X X B X X L H X Output Y L H L H High impedance
Rev.2.00 Jan 31, 2006 page 1 of 7
HD74HC257
Pin Arrangement
Select 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 8 (Top view) 1A 1B 1Y 2A 2B 2Y 3Y S OC 4A 4B 4Y 3A 3B 16 VCC 15 Output control 14 4A 13 4B 12 4Y 11 3A 10 3B 9 3Y
Logic Diagram
VCC 1A 1Y 1B VCC 2A 2Y 2B VCC 3A 3Y 3B VCC 4A 4Y 4B
Select
Output control
Rev.2.00 Jan 31, 2006 page 2 of 7
HD74HC257
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Symbol VCC VIN, VOUT IIK, IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 35 75 500 -65 to +150 Unit V V mA mA mA mW C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time*1 Symbol VCC VIN, VOUT Ta tr, tf Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500 0 to 400 Unit V V C ns Conditions
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Notes: 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 Off-state output current Input current Quiescent supply current IOZ Iin ICC 6.0 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- -- Ta = 25C Typ Max -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.5 0.1 4.0 Ta = -40 to+85C Unit Min Max 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 5.0 1.0 40 V Test Conditions
VIL
V
Output voltage
VOH
V
Vin = VIH or VIL IOH = -20 A
VOL
V
Vin = VIH or VIL
IOH = -6 mA IOH = -7.8 mA IOL = 20 A
IOL = 6 mA IOL = 7.8 mA A Vin = VIH or VIL, Vout = VCC or GND A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A
Rev.2.00 Jan 31, 2006 page 3 of 7
HD74HC257
Switching Characteristics
(CL = 50 pF, Input tr = tf = 6 ns)
Item Propagation delay time Symbol VCC (V) tPHL 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 Output disable time tLZ 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- Ta = 25C Min Typ Max -- -- 115 -- 11 23 -- -- 20 -- -- 115 -- 10 23 -- -- 20 -- -- 115 -- 14 23 -- -- 20 -- -- 115 -- 14 23 -- -- 20 -- -- 150 -- 11 30 -- -- 26 -- -- 150 -- -- -- -- -- -- -- -- -- -- -- -- 13 -- -- 14 -- -- 18 -- -- 4 -- 5 30 26 150 30 26 150 30 26 60 12 10 10 Ta = -40 to +85C Unit Test Conditions Min Max -- 145 ns Data to Y -- 29 -- 25 -- 145 ns -- 29 -- 25 -- 145 ns Select to Y -- 29 -- 25 -- 145 ns -- 29 -- 25 -- 190 ns Output control to Y -- 38 -- 33 -- 190 ns -- -- -- -- -- -- -- -- -- -- -- -- 38 33 190 38 33 190 38 33 75 15 13 10 ns Output control to Y
tPLH
tPHL
tPLH
Output enable time
tZL
tZH
tHZ
ns
Output rise/fall time Input capacitance
tTLH tTHL Cin
ns
pF
Test Circuit
VCC VCC 1Y Output 2Y Output 1B to 4B 3Y Output S 4Y Same as Load Circuit Same as Load Circuit Output 1 k OC Input Pulse Generator Zout = 50 S1 OPEN GND VCC Same as Load Circuit
See Function Table
CL = 50 pF 1A to 4A
TEST t PLH / t PHL t ZH/ t HZ t ZL / t LZ
S1 OPEN GND VCC
Note : 1. CL includes probe and jig capacitance.
Rev.2.00 Jan 31, 2006 page 4 of 7
HD74HC257
Waveforms
* Waveform - 1
tr 90 % 50 % 10 % t PLH 90 % 50 % 10 % t TLH 90 % 50 % 10 % t PHL 90 % 50 % 10 % t THL VOH VOL tf VCC 0V
Input
Same-phase output
t PHL 90 %
t PLH
Inverse-phase output
90 % 50 % 10 % t THL 50 % 10 % t TLH
VOH VOL
* Waveform - 2
90 % Input G
tf
tr 90 % 50 % 10 % t LZ VCC 0V VOH
50 % 10 % t ZL
Waveform - A t ZH Waveform - B
50 % t HZ
10 %
VOL VOH VOL
50 %
90 %
Notes : 1. Input waveform : PRR 1 MHz, duty cycle 50%, tr 6 ns, tf 6 ns 2. Waveform- A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform- B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement.
Rev.2.00 Jan 31, 2006 page 5 of 7
HD74HC257
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
L
1
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.2.00 Jan 31, 2006 page 6 of 7
HD74HC257
JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A Previous Code FP-16DNV MASS[Typ.] 0.15g
*1
D 9
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
Index mark
*2
E
HE
c
Reference Symbol
Dimension in Millimeters Min Nom 9.90 3.95 Max 10.30
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c c
1
0.10
0.14
0.25 1.75
0.34
0.40
0.46
0.15
0.20
0.25
HE
0 5.80 6.10 1.27
8 6.20
A
A1
L y
e x y
0.25 0.15 0.635 0.40
1
Detail F
Z L L 0.60 1.08
1.27
Rev.2.00 Jan 31, 2006 page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
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(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0


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